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INTEGRATED CIRCUITS
DATA SHEET
TDA7057Q 2 x 3 W stereo BTL audio output amplifier
Objective specification File under Integrated Circuits, IC01 May 1992
Philips Semiconductors
Objective specification
2 x 3 W stereo BTL audio output amplifier
FEATURES * No external components * No switch-on and off clicks * Good overall stability * Low power consumption * Short-circuit proof * Low HF radiation * ESD protected on all pins. QUICK REFERENCE DATA SYMBOL VP PO GV IP THD PARAMETER positive supply voltage range output power voltage gain total quiescent current total harmonic distortion VP = 11 V; RL = PO = 0.5 W VP = 11 V; RL = 16 CONDITIONS - 39 - - MIN. 3.0 3 40 10 0.25 TYP. 11 GENERAL DESCRIPTION
TDA7057Q
The TDA7057Q is a stereo output amplifier in a 13 pin power package. The device is designed for battery-fed portable stereo recorders and radios, but also suitable for mains-fed applications.
MAX. 18 - 41 14 1 V
UNIT W dB mA %
ORDERING INFORMATION EXTENDED TYPE NUMBER TDA7057Q Note 1. SOT141-6; 1996 September 9. PIN 13 PIN POSITION SBD PACKAGE MATERIAL plastic CODE SOT141(1)
May 1992
2
Philips Semiconductors
Objective specification
2 x 3 W stereo BTL audio output amplifier
TDA7057Q
VP
handbook, full pagewidth
3
I+i
13
positive output 1
input 1 signal ground 1
2 1
I-i
11
negative output 1
TDA7057Q
I-i
10
negative output 2
input 2 signal ground 2
4 5
I+i
8
positive output 2
7 n.c.
12 power ground 1
9 power ground 2
6 n.c.
MCD392
Fig.1 Block diagram.
May 1992
3
Philips Semiconductors
Objective specification
2 x 3 W stereo BTL audio output amplifier
PINNING SYMBOL SGND1 VI(1) VP VI(2) SGND2 n.c. n.c. OUT2+ PGND2 OUT2- OUT1- PGND1 OUT1+ PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 DESCRIPTION signal ground 1 voltage input 1 positive supply voltage voltage input 2 signal ground 2 not connected not connected positive output 2 power ground 2 negative output 2 negative output 1 power ground 1 positive output 1
handbook, halfpage
TDA7057Q
SGND1 VI (1) VP VI (2) SGND2 n.c. n.c. OUT2 + PGND2
1 2 3 4 5 6 7 8 9
TDA7057Q
OUT2 - 10 OUT1 - 11 PGND1 12 OUT1 + 13
MCD391
Fig.2 Pin configuration.
May 1992
4
Philips Semiconductors
Objective specification
2 x 3 W stereo BTL audio output amplifier
FUNCTIONAL DESCRIPTION
TDA7057Q
The TDA7057Q is a stereo output amplifier, designed for battery-fed applications e.g. portable radios, but also suitable for mains fed applications. The gain is internally fixed at 40 dB. For space reason there is a trend to decrease the number of battery cells. This means a decrease in supply voltage, resulting in a reduction of output power at conventional output stages. The latter is not preferred. Using the BTL principle increases the output power. The TDA7057Q can deliver an output power of 3 W in a speaker load of 16 with 11 V supply. The circuit is designed such that no external components are required. Special attention is given to switch-on and off clicks, low HF radiation and a good overall stability. The load can be short-circuited at all input conditions. LIMITING VALUES In accordance with the Absolute Maximum System (IEC 134). SYMBOL VP IORM IOSM Ptot Tstg Tvj Tsc PARAMETER positive supply voltage range repetitive peak output current non repetitive peak output current total power dissipation storage temperature range virtual junction temperature short-circuit time see note 1 Tcase < 60 C CONDITIONS - - - - -55 - - MIN. 1 1.5 9 +150 +150 1 MAX. 18 V A A W C C hr UNIT
Note to the limiting values 1. The load can be short-circuited at all input conditions. THERMAL RESISTANCE SYMBOL Rth j-a Rth j-c PARAMETER from junction to ambient in free air from junction to case THERMAL RESISTANCE 45 K/W 8 K/W
Note to the thermal resistance VP = 11 V; RL = 16 ; The maximum sine-wave dissipation is = 3 W; Tamb (max) = 60 C; Rth vj-a = (150 - 60)/3 = 30 K/W Rth vj-a = Rth vj-c + Rth c-HS + Rth HS Rth c-HS + Rth HS = 30 - 8 = 22 K/W
May 1992
5
Philips Semiconductors
Objective specification
2 x 3 W stereo BTL audio output amplifier
CHARACTERISTICS VP = 11 V; f = 1 kHz; RL = 16 ; Tamb = 25 C; unless otherwise specified SYMBOL VP IORM IP PO THD GV Vno(rms) Vno(rms) B SVRR Voff ZI Ibias GV PARAMETER positive supply voltage range repetitive peak output current RL = ; note 1 THD = 10% PO = 0.5 W note 2 note 3 note 4 RS = 5 k CONDITIONS - - 2.5 - 39 - - - 36 - - - RS = 5 k 40 - MIN. 3.0 11 - TYP.
TDA7057Q
MAX. 18 0.6
UNIT V A
Operating position total quiescent current output power total harmonic distortion voltage gain noise output voltage (RMS value) noise output voltage (RMS value) bandwidth supply voltage ripple rejection DC output offset voltage input impedance input bias current channel separation channel balance 10 3 0.25 40 180 60 60 - 100 100 - - 14 - 1 41 300 - - 200 - 300 - 1 mA W % dB V V dB mV k nA dB dB
20 Hz to 20 kHz -
Notes to the characteristics 1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being equal to the DC output offset voltage divided by RL. 2. The noise output voltage (RMS value) is measured with RS = 5 k unweighted (20 Hz to 20 kHz). 3. The noise output voltage RMS value) at f = 500 kHz is measured with RS = 0 and bandwidth = 5 kHz. With a practical load (RL = 16 , L = 200 H) the noise output current is only 50 nA. 4. The ripple rejection is measured with RS = 0 and f = 100 Hz to 10 kHz. The ripple voltage of 200 mV (RMS value) is applied to the positive supply rail.
May 1992
6
Philips Semiconductors
Objective specification
2 x 3 W stereo BTL audio output amplifier
APPLICATION INFORMATION
TDA7057Q
(1)
handbook, full pagewidth
VP 100 nF 220 F
3
I+i input 1 Rs 5 k 1 2
13
positive output 1
I-i
11
negative output 1
TDA7057Q
I-i
10
negative output 2
input 2 Rs 5 k
4 5
I+i
8
positive output 2
7
12
9
6
n.c.
n.c.
MCD393
ground
(1) This capacitor can be omitted if the 220 F electrolytic capacitor is connected close to pin 3.
Fig.3 Test and application diagram.
May 1992
7
Philips Semiconductors
Objective specification
2 x 3 W stereo BTL audio output amplifier
PACKAGE OUTLINE DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)
TDA7057Q
SOT141-6
non-concave x D Dh
Eh
view B: mounting base side
d
A2
B j E A
L3
L
Q c
1 Z e e1 bp wM
13 m e2 vM
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 17.0 15.5 A2 4.6 4.2 bp 0.75 0.60 c 0.48 0.38 D (1) 24.0 23.6 d 20.0 19.6 Dh 10 E (1) 12.2 11.8 e 3.4 e1 1.7 e2 5.08 Eh 6 j 3.4 3.1 L 12.4 11.0 L3 2.4 1.6 m 4.3 Q 2.1 1.8 v 0.8 w 0.25 x 0.03 Z (1) 2.00 1.45
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT141-6 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-03-11
May 1992
8
Philips Semiconductors
Objective specification
2 x 3 W stereo BTL audio output amplifier
SOLDERING Introduction
TDA7057Q
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
May 1992
9

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